Process capability of Flex-Rigid board
items | Content | Production capacity | Mass production capacity |
1 | PCB type | 3 Level HDI | 2 Level HDI |
2 | Layers | 18 | 12 |
3 | Finished board size (Max) | 500*850 | 250*750 |
4 | Board thickness (Mm-Max) | 0.1-4.0mm | 0.15-4.0mm |
5 | Finished thickness tolerance | 0.05mm | 10% |
6 | Copper thickmess (Mm-Max) | 9-105um | 9-70um |
7 | Insulation thickness ( Mm-Max) | 15- 200um | 25- 200um |
8 | CNC drill nozzle aperture (Mm) | 0.10mm | 0. 15mm |
9 | Laser drill nozzle aperture ( Mn) | 0.075mm | 0. 10mm |
10 | plated-through-hole | 0.05mm | 0.075mm |
11 | Bore tolerance (Non plated through hole) | 0.025 | 0.05 |
12 | Hole position tolerance (compared to CAD number) | 0.05 | 0.075 |
13 | PTH hole wall copper thick | 25um | 25um |
14 | Line width Spac ing (minimum) | 0.05 . | 0.075 |
15 | Pad design (minimum) | 0.3 | 0.5 |
16 | Goldfinger width (minimum) | 0.075 | 0.12 |
17 | Goldfinger width (minimum) | 0.075 | 0.1 |
18 | BGA pad (minimum) | 0.18 | 0.22 |
19 | Mnimum center distance between BGA pads | 0.1 | 0.15 |
20 | Tolerance of punching aperture | 0.05 | 0.075 |
21 | Spacing between hole and hole | 0.15 | 0.2 |
22 | Green mininum opening | 0.2 | 0.25 |
23 | The minimum distance from the green window to the edge of the line | 0.05 | 0.075 |
24 | Miminmum distance from line to board edge | 0.2 | 0.3 |
25 | Miminmum character | 0.8 | 1 |
26 | Overprint tolerance of thermosettng white oil | 0.15 | 0.2 |
27 | Etching tolerance | 10% | 20% |
28 | Miminum width of photosensitive green oil bridge | 0.1 | 0.15 |
29 | Miminmum width of thermoset white oil bridge | 0.2 | 0.3 |
30 | ENIG | 0.025 | 0.025 |
31 | Electric nickel gold | 0.05 | 0.05 |
32 | Immersion Tin | 0.05-0.2 | 0.05-0.2 |
33 | OSP | 0.8-1.2 | 0.8-1.2 |
34 | HAL Leaded | 1-25 | 1-25 |
35 | Immersion Silver | 0.05 | 0.05 |
36 | Punching shape tolerance (aser cutting) | 0.05 | 0.075 |
37 | Punching shape tolerance (slow -moving wire steel die) | 0.05 | 0.05 |
38 | Punching shape tolerance (fast-moving wire steel die) | 0.1 | 0.125 |
39 | Finished board impedance control | 5% | 10% |
40 | Thermal shock test of finished product | YES | YES |
41 | Solderability test of finished product | YES | YES |
42 | Finished product ion contamination test | YES | YES |
Copyright © 2024 Jinghua Technology (Shenzhen) Co., Ltd. All Rights Reserved. Privacy Policy