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Item

Advanced PCB

Standard PCB

Engineering

one file/1 days+ Senior engineer

mid-level engineer(1 files/hours)

Material 

Shengyi, Nanya ,Rogers, Arlon, Isola, Nelco etc.Meet IPC4101 class B/L

KB(kingboard)/GDM(goldenmax) Meet IPC4101 class B/L

Ink,Soldermasks 

TAIYO, Rongda,Kuangshun

Meet IPC-SM-840 class H, class 

Rongda,Kuangshun

Meet IPC-SM-840 class T, class 2

Drilling

Min Mechanical Hole Size 0.15mm,Laser hole 0.075mm

Min Mechanical Hole Size 0.2mm

Plating

±2mil,class 3

±3mil

Dimensional deviatio

±0.1mm,class 3

±0.15mm

Warping angl

0.5%, class 3

0.75%

Test metho

AOI, Kelvin Four-terminal sensing, Microsection Inspection, Solderability Test, Impedance Test...

AOI,Fly Probe Testing, E-test fixture

Etched lin

Forbid to repair tracks(IPC 3,Automotive,Customer Standard)


Cleanliness Ion 

contamination test



  • 1. Lamination
    1. Lamination
    After lamination, there will be slicing test (to confirm the thickness of the dielectric), thermal shock test (to confirm whether it is delaminated), and also copper foil adhesion test.
  • 2. Drilling
    2. Drilling
    We will control the service life of the drill tips. The drill tips are coated, which can prolong the service life and reduce the hole diameter. After drilling, there is a test for roughness of hole side, and drilling machine inspection to check the hole position, aperture, whether there is missing hole or plug hole, etc.
  • 3. Copper Plating
    3. Copper Plating
    Backlight test is performed after plating process to check the thickness for plated copper.
  • 4. Electroplating
    4. Electroplating
    CMI700 will be used to check the surface copper and hole wall copper. We normally use a small current for electroplating to ensure the even copper thickness.
  • 5. Developing and Etching
    5. Developing and Etching
    In this process, the engineer will check the width and spacing of the circuits for the first piece, and later perform another random check. There is a checking station for the developing process to ensure the good quality.
  • 6.AOI
    6.AOI
    AOI is performed after pattern plating. It is an automated optical inspection of PCBs in which a camera is used to scan the circuit board in extremely fine detail to check for any defects or malfunctions.
  • 7. Soldermask and Silkscreen
    7. Soldermask and Silkscreen
    We use LDI,automatic alignment exposure machine, to finish high quality soldermask process. Solder mask and silkscreen have to also go through QC semi-inspection, and there is also QA inspection (spot check) to check whether the solder mask is not fully developed, whether the solder mask enters the hole, whether the silkscreen printing is qualified, and whether the ink is too much to
  • 8. Electrical test
    8. Electrical test
    Flying probe test and fixture test are typically performed at this stage
  • 9. Routing
    9. Routing
    Now the boards will go through the routing process twice, and the second time is the fine routing.
  • 10. V-CUT
    10. V-CUT
    First sample inspection is needed after going through V-cut process.
  • 11. FQC
    11. FQC
    After the FQC inspection, there are also FQA random inspections, solder mask 3M adhesion tests, slicing test, and solderability test.
  • 12. Physical Lab
    12. Physical Lab
    The role of the physical laboratory is to use some devices to make quality tests on the boards of related processes. Commonly used tests include: metallographic microscope, X-ray inspection of inner layer, X-ray test of gold thickness, impedance tester, peel strength tester, coil resistance test, quadratic element, copper thickness tester, solderability test, backlight test
  • 13. Chemistry Lab
    13. Chemistry Lab
    The chemical laboratory generally checks the correct ratio of chemical ingredients to ensure the quality of the boards. Usually, some processes that need to use potions are inspected, including: copper plating, electroplating, solder mask, etching, developing, lamination of brown lines, surface treatment, etc.

Quality Certifications

Type:Manufacturer:product:TG:TD:DK:Halogen-free:cti:
FR4ShengyiS11411353104.6NO
FR4ShengyiS1000150
3354.9NO
FR4ShengyiS1000-21703304.8
NO
FR4ShengyiS1000-2M1803554.6NO
FR4ShengyiS11701753354.6NO
FR4ShengyiS1155170
3304.8YES
FR4KB61601353054.6NO
FR4KB6160c1353054.6NO600
FR4KB61651503354.65NO
FR4KB61671703574.65NO
FR4ISOLAFR406HR1702953.8NO
FR4ISOLAFR408HR1803703.63NO
FR4ISOLA370HR1803703.6NO
FR4VentecVT-471803904.27NO
FR4WAZAMH16001303104.6NO600
FR4WAZAMH140H1403404.6YES
FR4WAZAMH11701703404.6NO
FR4WAZAMH140A1303104.6NO
FR4GDMGF1111252804.5NO
FR4GDMGF1421703404.5NO
FR4GDMGF112T41253404.5NO400
FR4GDMGF112T61253404.5NO600
FR4TIEQIT1581553454.6NO
FR4TIEQTI1801703404.4
NO


Type:Manufacturer:product:TG:TD:DK:Halogen-free:
Ceramic polymerRogers4350B2803903.48No
Ceramic polymerRogers4003C2804253.38YES
Ceramic polymerRogersRO3210 28042510.2NO
PTFERogersR30032804253NO
PTFERogers58802803452.2NO
PTFETaconic TLX-82803452.55NO
PolyimideARLON85N2603804.3NO
PolyimideVentecVT-9012503954.27NO


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