One-stop PCB&PCBA Manufacturer since 2009
Language
One-stop PCB&PCBA Manufacturer since 2009
FPC process capability list
| items | content | Development ability | Mass production capacity |
| 1 | product type | (Double/multilayer) high-density multilayer board, rigid-flex board, RF antenna board | (Double/multilayer) high-density multilayer board, rigid-flex board,RF antenna board |
| 2 | Layer | 1-20L | 1-14L |
| 3 | Finished board size (Max) | 250*650 | 250*500 |
| 4 | Board thickness (Min-Max) | 0.08mm-3.0mm | 0.08mm-3.0mm |
| 5 | Finished product thickness tolerance | ±0.015mm | ±0.03mm |
| 6 | Copper foil thickness (Min-Max) | 1/3oz-4oz | 1/3oz-2oz |
| 7 | Insulation thickness (Min-Max) | 0.06mm-3.0 | 0.06mm-1.6mm |
| 8 | CNC drill hole diameter (Min) | 0.2mm | 0.2mm |
| 9 | Laser drill nozzle aperture (Min) | 0.1mm | 0.1mm |
| 10 | Aperture tolerance (plated through hole) | ±0.075mm | ±0.075mm |
| 11 | Tolerance of drilling hole diameter (non-plated through hole) | ±0.05mm | ±0.05mm |
| 12 | Hole position tolerance (compared with CAD number) | ±0.1mm | ±0.1mm |
| 13 | PTH hole wall copper thickness | ≥0.01mm | ≥0.01mm |
| 14 | Line width/spacing (minimum) | 0.05mm/0.05mm（1/3oz Copper foil） | 0.05mm/0.05mm（1/3oz Copper foil） |
| 15 | Pad design (minimum) | 0.23mm | 0.3mm |
| 16 | Gold finger width (minimum) | 0.05mm | 0.075mm |
| 17 | Gold finger spacing (minimum) | 0.05mm | 0.075mm |
| 18 | BGA pad (minimum) | 0.23mm | 0.3mm |
| 19 | Minimum center distance between BGA pads | 0.5mm | ＞0.5mm |
| 20 | Punching hole diameter tolerance | ±0.05mm | ±0.05mm |
| 21 | Via hole and via hole spacing | ≥0.1mm | ≥0.1mm |
| 22 | Green minimum opening | 0.075mm | 0.075mm |
| 23 | The minimum distance from the green window to the edge of the line | 0.075mm | 0.075mm |
| 24 | Minimum distance from line to board edge | 0.1mm（Laser） | 0.1mm（Precision mold） |
| 25 | Minimum character | Character height0.8mm/Word width0.13mm | Character height0.8mm/Word width0.13mm |
| 26 | Thermosetting white oil overprint tolerance | ±0.2mm | ±0.2mm |
| 27 | Etching tolerance | ±5% | ±15% |
| 28 | Minimum width of photosensitive green oil bridge | 0.125mm | 0.125mm |
| 29 | Minimum width of thermoset white oil bridge | 0.4mm | 0.4mm |
| 30 | ENIG | Gold thick/AU：0.025-0.125um Nickel thickness/Ni：1-4um | Gold thick/AU：0.025-0.125um Nickel thickness/Ni：1-4um |
| 31 | Electric nickel gold | Gold thick/AU：0.05-2.5um Nickel thickness/Ni：1-5um | Gold thick/AU：0.05-2.5um Nickel thickness/Ni：1-5um |
| 32 | Immersion Tin | Sn: 0.025-0.125um | Sn: 0.025-0.125um |
| 33 | OSP | 0.1-0.5um | 0.1-0.5um |
| 34 | Pure tin spray | 1-40um | 1-40um |
| 35 | HAL Leaded | 1-40um | 1-40um |
| 36 | Immersion Sliver | ≥0.15um | ≥0.15um |
| 37 | Punching shape tolerance (laser cutting) | ±0.05mm | ±0.05mm |
| 38 | Punching shape tolerance (slow-moving wire steel die) | ±0.05mm | ±0.05mm |
| 39 | Punching shape tolerance (fast-moving wire steel die) | ±0.1mm | ±0.1mm |
| 40 | Finished board impedance control | ±10% | ±10% |
| 41 | Finished product short-circuit test | 100% | 100% |
| 42 | Thermal shock test of finished product | 288±5℃/10S/3T/No delamination/foaming | 288±5℃/10S/3T/No delamination/foaming |
| 43 | Solderability test of finished product | 245±5℃/3-5S/Semi-humid≤3% | 245±5℃/3-5S/Semi-humid≤3% |
| 44 | Peel strength of finished product | ≥0.8kg/cm | ≥0.8kg/cm |
| 45 | Ion contamination test of finished product | ≤3ug/inch2 | ≤3ug/inch2 |
| 46 | Finished product aging | 72H、70℃ | 72H、70℃ |
JH PCBA, one-stop Chinese PCB&PCBA
manufacturer since 2009.
ISO9001, ISO14001, IATF16949 automotive,
Rohs certificated.
Payment Methods：
CONTACT DETAILS
3rd Floor, Building A, Zedali Industrial Park, No. 26 Jian’an Road, Tangwei Community, Fuhai Street, Baoan District, Shenzhen City, China
+86 0755 - 2992 2552
Sales Manager Mobile Phone: +86 13590460002
(same number as Wechat and Whatsapp)
Delivery Services：
CONTACT US
Copyright © 2024 Jinghua Technology (Shenzhen) Co., Ltd. All Rights Reserved. Privacy Policy
