The technologies have been upgraded to adapt to the fast-changing needs of the competitive market. As the manufacturing technologies advance, the performance of the finished 13 Years Experience Oem High Frequency Android Mobile Pcb Board Manufacturing Design Other Pcb has been improved a lot.It has an enormous effect on the field(s) of Heavy Copper PCB.
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State-of-the-art technologies are introduced and upgraded for the more efficient and stable manufacturing of the product. 13 Years Experience Oem High Frequency Android Mobile Pcb Board Manufacturing Design Other Pcb functions perfectly in the application scenario(s) of Thick Copper PCB. High-end technologies are adopted to manufacture the product.When the product is manufactured and used in the field(s) of Heavy Copper PCB, its stability and advantages can be fully played out. Jinhua Technology (Shenzhen) Co., Ltd. has successfully expanded its business in market in the past few years and it is very possible for the company to have a better development in the future.
Model Number | PCB | Type | heavy copper pcb |
Place of Origin | Guangdong, China | Brand Name | JinHua |
Base Material | Custom | Copper Thickness | Custom |
Board Thickness | Custom | Product name | Pcb Board Assembly |
Application | Electronics Device | Material | FR4 /aluminum/ceramic CEM1 |
Usage | OEM Electronics | Solder mask | Green. Red. Blue. White. Black.Yellow |
Layer | 1-24 Layers | Service | One-stop Service |
Silkscreen color | Black.white.yellow.red.blue | Testing Service | 100% |
Certificate | ISO9001 |
Item | What can we do? |
PCB | Manufacture PCB as substrate for SMT |
PCBA | Powerful capacity, advanced SMT technology |
We have over 10-year experience, have competitive price than most suppliers | |
Custom Service | Talent engineer team, one-stop custom service offer |
Finished Products | We also support finished products production |
Item | Capacity |
Product Name | PCB/PCBA Electronic Printed Circuits Boards |
Base Material | FR-4/High TG FR-4/Halogen free material |
Number of Layer | 1-32 layers |
Finished Inner/Outer Copper Thickness | 1-6OZ |
Finished Board Thickness | 0.2-7.0mm |
Min Hole Size | Mechanical hole: 0.15mm, laser hole: 0.10mm |
Controlled Inpedance | +/- 5% |
Plugging Vias Capacity | 0.2-0.8mm |
Outline Profile | Rout/V-cut/Bridge/Stamp |
Surface Treatment | HASL/HASL lead free/Immersion Gold/Immersion Tin/Immersion Sliver/Hard gold/Flash gold/OSP/... |
Component Details | Passive Down to 0201 size BGA and VFBGA Leadless Chip Carriers/CSP Double-sided SMT Assembly Fine Pitch to 0.8mils BGA Repair and Reball Part Removal and Replacement |
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