Standard Rigid PCB Capability

VR

FR-4 PCB Capabilities

No.ItemManufacturing Capabilities Illustration
1MaterialFR-4 (Fiberglass)For Rogers, Taconic, ARLON and other HDI boards, please contact JH PCBA for details.
2Number of Layers

1 Layer, 2 Layers, 4 Layers, 6 Layer, 8 Layers,10 Layers

Standard stackup for multilayer pcbs.
3TG GradeTG130~140, TG150~160, TG170~180
4Max PCB Size 

1 layer & 2 layers: 1200*300mm or 610*520mm

Multi-layers: 610*520mm

5Min PCB Size5mm*5mm
6Board Size Tolerance(Outline)

±0.1mm(CNC routing)

±0.5mm(V-scoring)

7Surface FinishHASL with lead, HASL lead free, Immersion gold(ENIG), OSP, Hard gold, ENEPIG, Immersion silver (Ag), None
8Board Thickness

1 Layer/2 Layers: 0.2~2.4mm

4 Layers: 0.4~2.4mm

6 Layers: 0.8~2.4mm

8 Layers: 1.0~2.4mm

10 Layers: 1.2~2.4mm


               

Note: Customized PCB thickness and Layer stackup are acceptable.

9Board Thickness Tolerance

Thickness≥1.0mm: ±10%

Thickness<1.0mm: ±0.1mm


               

Note: Normally “+ Tolerance” will occur due to PCB processing steps such as electroless copper, solder mask and other types of finish on the surface.

10Outer Layer Copper Thickness

1oz/2oz/3oz/4oz/5oz

(35μm/70μm/105μm/140um/175um)


Note: 

2oz

Via size≥0.25mm,

Min Track/Spacing≥0.15mm 


3oz

Via size≥0.3mm,

Min Track/Spacing≥0.2mm


4oz   

via size>=0.3mm

min track/spacing>=0.3mm 


5oz  

via size>=0.3mm 

min track/spacing>=0.35mm

11Inner Layer Copper Thickness

1oz/2oz/3oz 

(35μm/70μm/105um)

12Outer layer Min track/spacing≥3mil
13Inner layer Min track/spacing≥4mil
14 Annular Ring Size≥0.1mm
15Grid Line track/spacing≥0.2mm
16Coil board Line track/spacing≥0.2mm
17BGA pad size≥0.13mm
18BGA Distance≥0.12mm 
19Board Outlines 

Track to Outline: ≥0.3mm 

Trace to V-cut line: ≥0.4mm

20Finished Hole Size Tolerance ±0.08mm
21Finished Hole Diameter(CNC)

0.15mm~6.3mm


1. PCB Thickness=2.0mm, Min hole size is 0.25mm

2. PCB Thickness=2.4mm, Min hole size is 0.3mm

3. Copper Thickness=2OZ, Min hole size is 0.25mm

4. Copper Thickness=3OZ, Min hole size is 0.3m

22TH Via Distance

Same nets: 0.15mm

Different net: 0.25m

23Plated Slot Size≥0.5mm


               

Note:

L:W=2.5: 1 (Should be 2.5:1 or 

higher. If it is less than this, the holes may be misaligned.)  If you can't draw a long hole in your design, you can draw a continuous round hole and it will be regarded as a long hole. Also, it is okay to draw the oblong hole in Profile Layer instead of  Drilling Layer.

24Castellated Holes≥0.5mm
25Non-Plated Holes≥0.2mm
26NPTH to Copper Line≥0.2mm
27SoldermaskGreen, Red, Yellow, White, Black, Blue, Purple, Matte Green,Matte Black,None
28Soldermask Thickness 20~30um 
29Soldermask Bridge 

Green: ≥0.1mm

Others: ≥0.15m

30Soldermask to soldering pad distance≥0.05mm
31SilkscreenWhite, Black, Yellow, None
32Minimum Character Width(Legend) 

≥0.13mm


               

Note: Characters of less than 0.13mm wide will be too narrow to be identifiable

33Minimum Character Height (Legend)

≥0.7mm


               

Note: Characters of less than 0.7mm high will be too small to be recognizable

34Character Width to Height Ratio (Legend)1: 6 (In PCB silkscreen legends processing, 1:6 is the most suitable ratio)
35Silkscreen to Soldering Pad Distance≥0.1mm
36V-cut Line

≥70mm


               

Note:

PCB thickness≥0.5mm

Details refer to right side 

picture

37V-cut Line Distance≥3.5mm
38Distance betwen Board to Board≥0.8mm
39Stamp-hole Width

≥2.0mm


               

Note: PCB size and thickness are subject to review by JH PCBA.

40Tab-route Width

≥1.6mm


               

Note: PCB size and thickness are subject to review by JH PCBA.

41Edge Rail

≥3.5mm


               

Note: If choosing panel by JH PCBA , we will add 5mm edge rails on both sides by default.

42Gold FingerBevelling Angle: 20°,30°,45°

Depth: ≥1mm

Length: 45mm~280mm


               

Note: Board thickness≥1.2mm

43Special Specification

Impedance control

Custom Layer Stackup

Interstitial Via Hole(IVH)

Via in pad

Via filled with resin

Countersinks/Counterbores

Carbon Mask

Halogen-Free

Z-axis milling

Edge Plating

Others



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